cystech electronics corp. spec. no. : c824a3 issued date : 2007.02.28 revised date : 2012.12.27 page no. : 1/7 btb1198a3 cystek product specification pnp epitaxial planar transistor btb1198a3 features ? low v ce(sat) , v ce(sat) = -0.16v (typ.) @ i c /i b =-500ma/-50ma ? high breakdown voltage, bv ceo =-80v ? complementary to btd1768a3 ? pb-free lead plating and halogen-free package symbol outline btb1198a3 to-92 absolute maximum ratings (ta=25 c) parameter symbol limits unit collector-base voltage v cbo -80 v collector-emitter voltage v ceo -80 v emitter-base voltage v ebo -5 v collector current (dc) i c -1 a collector current (pulse) i cp -2 (note) a power dissipation p d 750 mw thermal resistance, junction to ambient r ja 167 c/w operating junction temperature range tj -55~+150 c storage temperature range tstg -55~+150 c note : pulse test, p w 10ms, duty 50%. e c b b base c collector e emitter
cystech electronics corp. spec. no. : c824a3 issued date : 2007.02.28 revised date : 2012.12.27 page no. : 2/7 btb1198a3 cystek product specification characteristics (ta=25 c) symbol min. typ. max. unit test conditions bv cbo -80 - - v i c =-50 a bv ceo -80 - - v i c =-2ma bv ebo -5 - - v i e =-50 a i cbo - - -0.5 a v cb =-50v i ebo - - -0.5 a v eb =-4v *v ce(sat) - -0.16 -0.5 v i c =-500ma, i b =-50ma *h fe 120 - 560 - v ce =-3v, i c =-100ma f t - 180 - mhz v ce =-10v, i c =-50ma, f=100mhz cob - 11 - pf v cb =-10v, f=1mhz *pulse test: pulse width 380 s, duty cycle 2% classification of h fe rank q r s range 120~270 180~390 270~560 ordering information device hfe rank package shipping btb1198a3-q-bk-g q to-92 (pb-free lead plating and halogen-free package) 1000 pcs/ bag, 10 bags/box, 10boxes/carton BTB1198A3-R-BK-G r to-92 (pb-free lead plating and halogen-free package) 1000 pcs/ bag, 10 bags/box, 10boxes/carton btb1198a3-s-bk-g s to-92 (pb-free lead plating and halogen-free package) 1000 pcs/ bag, 10 bags/box, 10boxes/carton btb1198a3-q-tb-g q to-92 (pb-free lead plating and halogen-free package) 2000 pcs / tape & box btb1198a3-r-tb-g r to-92 (pb-free lead plating and halogen-free package) 2000 pcs / tape & box btb1198a3-s-tb-g s to-92 (pb-free lead plating and halogen-free package) 2000 pcs / tape & box
cystech electronics corp. spec. no. : c824a3 issued date : 2007.02.28 revised date : 2012.12.27 page no. : 3/7 btb1198a3 cystek product specification characteristic curves output characteristics 0 0.05 0.1 0123456 collector-to-emitter voltage---vce(v) collector current---ic(a) ib=0 ib=100ua ib=200ua ib=300ua ib=400ua ib=500ua output characteristics 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0123456 collector-to-emitter voltage---vce(v) collector current---ic(a) ib=0 ib=500ua ib=1ma ib=1.5ma ib=2ma ib=2.5ma output characteristics 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0123456 collector-to-emitter voltage---vce(v) collector current---ic(a) ib=0 ib=2ma ib=4ma ib=6ma ib=8ma ib=10ma output characteristics 0 0.2 0.4 0.6 0.8 1 1.2 0123456 collector-to-emitter voltage---vce(v) collector current---ic(a) ib=0 ib=5ma ib = 10m a ib=15ma ib = 20m a ib = 25m a current gain vs collector current 1 10 100 1000 1 10 100 1000 10000 collector current---ic(ma) current gain---hfe vce=1v vce=2v vc e = 3v saturation voltage vs collector current 10 100 1000 10000 1 10 100 1000 10000 collector current---ic(ma) saturation voltage---(mv) ic=10ib ic=20ib ic=25ib vce(sat)
cystech electronics corp. spec. no. : c824a3 issued date : 2007.02.28 revised date : 2012.12.27 page no. : 4/7 btb1198a3 cystek product specification characteristic curves(cont.) saturation voltage vs collector current 100 1000 10000 1 10 100 1000 10000 collector current---ic(ma) saturation voltage---(mv) vbe(sat)@ic=10ib power derating curve 0 100 200 300 400 500 600 700 800 0 50 100 150 200 ambient temperature---ta() power dissipation---pd(mw)
cystech electronics corp. spec. no. : c824a3 issued date : 2007.02.28 revised date : 2012.12.27 page no. : 5/7 btb1198a3 cystek product specification to-92 taping outline millimeters dim item min. max. a component body height 4.33 4.83 d tape feed diameter 3.80 4.20 h2a h2a h2 h2 d2 a h w w1 h3 h4 h1 l1 l p2 p p1 f1 f2 d1 d t2 t t1 d1 lead diameter 0.36 0.53 d2 component body diameter 4.33 4.83 f1,f2 component lead pitch 2.40 2.90 f1,f2 f1-f2 - 0.3 h height of seating plane 15.50 16.50 h1 feed hole location 8.50 9.50 h2 front to rear deflection - 1 h2a deflection left or right - 1 h3 component height - 27 h4 feed hole to bottom of component - 21 l lead length after component removal - 11 l1 lead wire enclosure 2.50 - p feed hole pitch 12.50 12.90 p1 center of seating plane location 5.95 6.75 p2 4 feed hole pitch 50.30 51.30 t over all tape thickness - 0.55 t1 total taped package thickness - 1.42 t2 carrier tape thickness 0.36 0.68 w tape width 17.50 19.00 w1 adhesive tape width 5.00 7.00 - 20 pcs pitch 253 255
cystech electronics corp. spec. no. : c824a3 issued date : 2007.02.28 revised date : 2012.12.27 page no. : 6/7 btb1198a3 cystek product specification recommended wave soldering condition soldering time product peak temperature pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds 183 c 60-150 seconds time maintained above: ? temperature (t l ) 217 c ? time (t l ) 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak 10-30 seconds 20-40 seconds temperature(tp) ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max.
cystech electronics corp. spec. no. : c824a3 issued date : 2007.02.28 revised date : 2012.12.27 page no. : 7/7 btb1198a3 cystek product specification to-92 dimension *: typical inches millimeters inches b1 198 hfe rank 3 1 a d b c i 1 e f 2 3 g h 2 s t yle: pin 1.emitter 2.colle ctor 3.ba se 3-l ead t o -9 2 plastic pa ckag e cys t ek pa ck a g e code: a 3 9 9, a 10, b 11 , c 12 product name date code: y ear+month y ear: 4 2004, 5 20 05 month: 1 1, 2 2, ??? , marking: m i l l i m e t e r s dim m i n . m a x . m i n . m a x . dim m i n . m a x . m i n . m a x . a 0 . 1 7 0 4 0 . 1 9 0 2 4 . 3 3 4 . 8 3 g 0.0142 0 . 0 2 2 0 0 . 3 6 0 . 5 6 b 0 . 1 7 0 4 0 . 1 9 0 2 4 . 3 3 4 . 8 3 h - * 0 . 1 0 0 0 - * 2.54 c 0 . 5 0 0 0 - 1 2 . 7 0 - i - * 0 . 0 5 0 0 - * 1.27 d 0 . 0 1 4 2 0 . 0 2 2 0 0 . 3 6 0 . 5 6 1 - * 5 - * 5 e - * 0 . 0 5 0 0 - * 1.27 2 - * 2 - * 2 f 0 . 1 3 2 3 0 . 1 4 8 0 3 . 3 6 3 . 7 6 - 3 * 2 - * 2 note s: 1.controlling dimension: millimeter s. 2.maximum lead thickness include s lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is an y q uestion w i th p a ck ing specification or p a cking metho d , please c ont act y our local c y s t ek sales of fice. material: ? lead: pur e tin plated. ? mold compou n d : epoxy resin fa mily , flammabilit y solid burning cla ss: ul94v -0. im portan t n o tice : ? all rights are re served. reprod u c tion in w hole or in part is prohibited w i thout the p r ior w r itten a pprov al of c y stek. ? c y stek reserv es the right to m a ke changes to its products w i tho u t notice. ? cy st e k semic ond uct o r pr odu cts are n o t warr ante d t o be s u it able f o r use i n l i fe-su p p o rt a p p licatio ns, or sys tems. ? c y stek assumes no liability fo r an y consequenc e of customer pr oduct design, infringement of pat e n ts, or application assistance .
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